ANTI/Foam CR-99
ANTI/Foam CR-99 is a non-silicon, non-solvent based anti-foam designed to be used in conveyorized spray equipment when developing and stripping aqueous processable dry film and LPISM.
ANTI/Foam CR-99 is a non-silicon, non-solvent based anti-foam designed to be used in conveyorized spray equipment when developing and stripping aqueous processable dry film and LPISM.
ANTI/Foam CR-D is a non-silicon foam control agent formulated to inhibit foaming associated with photopolymer developing and stripping.
EQUIPMENT/Cleaner 20 is a highly concentrated detergent designed specifically to remove chemical scale, hard water scale, dry film and LPISM residue, and anti-foam residue from automated developing and resist stripping equipment.
EQUIPMENT/Cleaner 60 is a concentrated acid cleaner designed for use in developers, resist strippers and other processing tanks.
EQUIPMENT/Cleaner 70 is a concentrated acid cleaner designed for use in developers, resist strippers and other processing tanks.
PRO/Strip 2101-B is the second step of a twostep, nitric acid based tin and tin-lead stripping solution designed specifically for dual tank dip applications.
PRO/Strip 2100S Special is the first step of a two-step nitric acid-based tin and tin-lead stripping solution designed specifically for dual tank dip applications.
PRO/Strip 3040 is an economical, single step, nitric acid / ferric nitrate-based tin and tin-lead stripping solution designed specifically for spray applications.
ENVIRO/Strip Cu is an economical, single step, hydrogen peroxide/bifluoride based tin and tin-lead stripping solution designed specifically for spray applications.
ENVIRO/Bright SC-2 is a concentrated, acidic cleaner used to clean and deoxidize unfused tin-lead surfaces prior to hot oil fusing.
Dissolvene MS-40 is an aqueous based alkaline solution designed to strip and remove a cured dry film solder mask as well as most liquid solder masks from printed circuit boards.
Screen Cleaner SC-400 is designed to remove soldermask ink from screen printed fabrics.
ENVIRO/Etch Make-up is a stabilized formulation designed to provide optimum micro-roughening and cleaning of copper surfaces prior to dry film lamination, oxide treatment, electroless copper deposition, and final finishing processes.
ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards.
ENVIRO/Flow HAL-54 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process.
ACP 191 is an aqueous high charge density inorganic/organic cationic coagulant blend.
Discover more about Seacole’s diverse product portfolio for the agriculture, industrial cleaning, medical, surface finishing, microelectronics, and printed circuit board markets.
