Cu/Scrub 4F-9.1

Product Code

0003001

Product Description

Cu/SCRUB 4F-9.1 is an acidified pumice scrub designed to promote cleaning and micro-roughening of copper laminate. Cu/SCRUB 4F-9.1 is formulated with 4F Grade, friable pumice and contains antioxidant components to inhibit cupric oxide formation after the cleaning cycle. During use, fractured particles from friable pumice continue to present sharp cutting edges rather than rounding off, thereby assuring a long and consistent operating life. Cu/SCRUB 4F-9.1 also exhibits a low concentration of free silica and is therefore safer to work with than traditional pumice.

Performance Features

  • Cu/SCRUB 4F-9.1 is mildly acidified, thereby chemically stripping light oxides from the copper surface while producing a uniform micro-roughened copper surface.
  • Cu/SCRUB 4F-9.1 contains antioxidants to protect the cleaned copper.
  • Cu/SCRUB 4F-9.1 is formulated with friable 4F Grade pumice, assuring a continued source of sharp edges as the material fractures during use.
  • Cu/SCRUB 4F-9.1 contains a low concentration of free silica, promoting a safe working environment.

CONTACT US

More Products

EQUIPMENT/Cleaner 70

EQUIPMENT/Cleaner 70 is a concentrated acid cleaner designed for use in developers, resist strippers and other processing tanks.

Screen Cleaner SC-400

Screen Cleaner SC-400 is designed to remove soldermask ink from screen printed fabrics.

PC-750

PC-750 is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks.
Seacole Logo Horiz Rgb 400px.png

Contact Us