Dissolvene MS-40 is an aqueous based alkaline solution designed to strip and remove a cured dry film solder mask as well as most liquid solder masks from printed circuit boards.
Performance Features
Dissolvene MS-40 will not attack bottom coat of base laminate
Dissolvene MS-40 will effectively remove all cured dry film and liquid photo-imageable solder mask in about 10-40 minutes
PRO/Strip 2100S Special is the first step of a two-step nitric acid-based tin and tin-lead stripping solution designed specifically for dual tank dip applications.
EQUIPMENT/Cleaner 20 is a highly concentrated detergent designed specifically to remove chemical scale, hard water scale, dry film and LPISM residue, and anti-foam residue from automated developing and resist stripping equipment.
