Dissolvene MS-40 is an aqueous based alkaline solution designed to strip and remove a cured dry film solder mask as well as most liquid solder masks from printed circuit boards.
Performance Features
Dissolvene MS-40 will not attack bottom coat of base laminate
Dissolvene MS-40 will effectively remove all cured dry film and liquid photo-imageable solder mask in about 10-40 minutes
Film Cleaner 101 removes oil, grease, dust, and fingerprints from all types of film including Diazo Emulsion Imaging films. Film Cleaner 101 is formulated with an anti-static agent for removing static from nonconductive films.
