Dissolvene MS-40 is an aqueous based alkaline solution designed to strip and remove a cured dry film solder mask as well as most liquid solder masks from printed circuit boards.
Performance Features
Dissolvene MS-40 will not attack bottom coat of base laminate
Dissolvene MS-40 will effectively remove all cured dry film and liquid photo-imageable solder mask in about 10-40 minutes
ANTI/Foam CR-98 is a non-silicon, non-solvent based anti-foam designed to be used in conveyorized spray equipment when developing and stripping aqueous processable dry film and LPISM.
PRO/Strip 2101-B is the second step of a twostep, nitric acid based tin and tin-lead stripping solution designed specifically for dual tank dip applications.
