ENVIRO/Strip Cu

Product Code

0005340

Product Description

ENVIRO/Strip Cu is an economical, single step, hydrogen peroxide/bifluoride based tin and tin-lead stripping solution designed specifically for spray applications. Depending upon use, ENVIRO/Strip Cu can strip up to 150 g/L (20 opg) total metal with minimal precipitate formation. ENVIRO/Strip Cu is equally effective stripping plated or fused solder. Additionally, the copper inhibitor package minimizes copper attack, leaving a uniformly clean and bright copper surface, improving AOI inspection; and virtually eliminating the potential for solution exotherm. ENVIRO/Strip Cu is suitable for feed and bleed replenishment.

Performance Features

  • High throughput yields while minimizing precipitate (sludging) formation.
  • ENVIRO/Strip Cu is designed to be operated in spray application and is suitable for feed and bleed replenishment.
  • ENVIRO/Strip Cu exhibits minimal copper attack, improving process latitude and copper appearance after stripping.

CONTACT US

More Products

ENVIRO/Flow HAL-30

ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards.

ANTI/Foam CR-W

ANTI/Foam CR-W is a concentrated aqueous emulsion of unique defoaming and foam preventing materials.

POLY/Solv RS-740

POLY/Solv RS-740 is a highly concentrated solution designed to economically and efficiently strip most commercially available, fully aqueous dry film resists.
Seacole Logo Horiz Rgb 400px.png

Contact Us