ENVIRO/Flow HAL-54

Product Code

0005654

Product Description

ENVIRO/Flow HAL-54 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. ENVIRO/Flow HAL- 54 will remove light copper oxides and lay down a protective layer of flux to protect soldermask and promote good solderability of copper pads. ENVIRO/Flow HAL-54 will provide a bright uniform solder finish with good rinsability. ENVIRO/Flow HAL-54 is a solvent free flux, non-foaming formulation that is compatible with LPI and dry film soldermasks.

Performance Features

  • Removes light copper oxides
  • Protects soldermask
  • Promotes excellent solderability of copper pads

CONTACT US

More Products

PC-450

PC 450 is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks.

POLY/Solv RS-50

POLY/Solv RS-50 is a concentrated solution designed to economically and efficiently strip all commercially available, fully aqueous dry film resists.

ENVIRO/Etch Make-up

ENVIRO/Etch Make-up is a stabilized formulation designed to provide optimum micro-roughening and cleaning of copper surfaces prior to dry film lamination, oxide treatment, electroless copper deposition, and final finishing processes.
Seacole Logo Horiz Rgb 400px.png

Contact Us

Contact Us to Order Products