ENVIRO/Flow HAL-30

Product Code

0005630

Product Description

ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards. ENVIRO/Flow Hall-30 is a low acid formulation minimizing equipment wear.

Performance Features

  • Removes copper oxides
  • Deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface
  • Reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing
  • Does not contain glycol ethers or activators which could attack solder mask or laminate

CONTACT US

More Products

ENVIRO/Flow HAL-54

ENVIRO/Flow HAL-54 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process.

EQUIPMENT/Cleaner 20

EQUIPMENT/Cleaner 20 is a highly concentrated detergent designed specifically to remove chemical scale, hard water scale, dry film and LPISM residue, and anti-foam residue from automated developing and resist stripping equipment.

Cu/Scrub 4F-9.1

Cu/SCRUB 4F-9.1 is an acidified pumice scrub designed to promote cleaning and micro-roughening of copper laminate.
Seacole Logo Horiz Rgb 400px.png

Contact Us