ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards. ENVIRO/Flow Hall-30 is a low acid formulation minimizing equipment wear.
Performance Features
Removes copper oxides
Deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface
Reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing
Does not contain glycol ethers or activators which could attack solder mask or laminate
Dissolvene MS-40 is an aqueous based alkaline solution designed to strip and remove a cured dry film solder mask as well as most liquid solder masks from printed circuit boards.
ENVIRO/Strip Cu is an economical, single step, hydrogen peroxide/bifluoride based tin and tin-lead stripping solution designed specifically for spray applications.
RE/Gen CC-40 is a concentrated, stabilized, and buffered sodium chlorate solution designed to economically and safely regenerate cupric chloride etching systems.
