ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards. ENVIRO/Flow Hall-30 is a low acid formulation minimizing equipment wear.
Performance Features
Removes copper oxides
Deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface
Reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing
Does not contain glycol ethers or activators which could attack solder mask or laminate
PRO/Strip 2100S Special is the first step of a two-step nitric acid-based tin and tin-lead stripping solution designed specifically for dual tank dip applications.
ENVIRO/Strip Cu is an economical, single step, hydrogen peroxide/bifluoride based tin and tin-lead stripping solution designed specifically for spray applications.
