ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards. ENVIRO/Flow Hall-30 is a low acid formulation minimizing equipment wear.
Performance Features
Removes copper oxides
Deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface
Reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing
Does not contain glycol ethers or activators which could attack solder mask or laminate
AP 720 is a water based high molecular weight anionic flocculant (polymer) designed for use in a variety of industrial and municipal wastewater treatment applications.
