Dissolvene MS-40 is an aqueous based alkaline solution designed to strip and remove a cured dry film solder mask as well as most liquid solder masks from printed circuit boards.
Performance Features
Dissolvene MS-40 will not attack bottom coat of base laminate
Dissolvene MS-40 will effectively remove all cured dry film and liquid photo-imageable solder mask in about 10-40 minutes
RE/Gen CC-40 is a concentrated, stabilized, and buffered sodium chlorate solution designed to economically and safely regenerate cupric chloride etching systems.
POLY/Solv RS-70 is a highly concentrated solution designed to economically and efficiently strip most of the commercially available, fully aqueous dry film resists.
