Dissolvene MS-40 is an aqueous based alkaline solution designed to strip and remove a cured dry film solder mask as well as most liquid solder masks from printed circuit boards.
Performance Features
Dissolvene MS-40 will not attack bottom coat of base laminate
Dissolvene MS-40 will effectively remove all cured dry film and liquid photo-imageable solder mask in about 10-40 minutes
ANTI/Foam CR-98 is a non-silicon, non-solvent based anti-foam designed to be used in conveyorized spray equipment when developing and stripping aqueous processable dry film and LPISM.
POLY/Solv RS-70 is a highly concentrated solution designed to economically and efficiently strip most of the commercially available, fully aqueous dry film resists.
AP 600 is a medium molecular weight anionic emulsion flocculant (polymer) designed for use in a variety of industrial and municipal wastewater treatment applications.
