Product Supplier: Seacole

PRO/Strip 2100S Special

PRO/Strip 2100S Special is the first step of a two-step nitric acid-based tin and tin-lead stripping solution designed specifically for dual tank dip applications.

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PRO/Strip 3040

PRO/Strip 3040 is an economical, single step, nitric acid / ferric nitrate-based tin and tin-lead stripping solution designed specifically for spray applications.

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ENVIRO/Strip Cu

ENVIRO/Strip Cu is an economical, single step, hydrogen peroxide/bifluoride based tin and tin-lead stripping solution designed specifically for spray applications.

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PRO/Strip 2101-B

PRO/Strip 2101-B is the second step of a twostep, nitric acid based tin and tin-lead stripping solution designed specifically for dual tank dip applications.

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Dissolvene MS 40

Dissolvene MS-40 is an aqueous based alkaline solution designed to strip and remove a cured dry film solder mask as well as most liquid solder masks from printed circuit boards.

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ENVIRO/Etch Make-up

ENVIRO/Etch Make-up is a stabilized formulation designed to provide optimum micro-roughening and cleaning of copper surfaces prior to dry film lamination, oxide treatment, electroless copper deposition, and final finishing processes.

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ENVIRO/Flow HAL-30

ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards.

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CHROME/Clean AC-1S

CHROME/Clean AC-1S is a concentrated, non-etching, free-rinsing acid cleaner designed specifically to remove chromate and zincate anti-tarnish coatings from copper foil.

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SEACOLE PRODUCTS

Discover more about Seacole’s diverse product portfolio for the agriculture, industrial cleaning, medical, surface finishing, microelectronics, and printed circuit board markets.

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