ENVIRO/Etch Make-up is a stabilized formulation designed to provide optimum micro-roughening and cleaning of copper surfaces prior to dry film lamination, oxide treatment, electroless copper deposition, and final finishing processes.
ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards.
ENVIRO/Flow HAL-54 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process.
Discover more about Seacole’s diverse product portfolio for the agriculture, industrial cleaning, medical, surface finishing, microelectronics, and printed circuit board markets.
