ENVIRO/Flow HAL-54 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. ENVIRO/Flow HAL- 54 will remove light copper oxides and lay down a protective layer of flux to protect soldermask and promote good solderability of copper pads. ENVIRO/Flow HAL-54 will provide a bright uniform solder finish with good rinsability. ENVIRO/Flow HAL-54 is a solvent free flux, non-foaming formulation that is compatible with LPI and dry film soldermasks.
