CU/Etch ME-45

Product Code

0005231

Product Description

Cu/ETCH ME-45 is a highly stable, easy to operate copper microetchant. It is an excellent micro etch for use prior to dry film lamination, oxide coating, electroless plating or solder leveling. Long bath life can be obtained by replenishment based on simple chemical analysis. Cu/ETCH ME-45 can be operated in either immersion or spray equipment.

Performance Features

Highly Stable
Economical
Long Bath Life
Formulated for either Immersion or Spray Equipment

Technical Data Sheet (TDS)

Product Categories

Printed Circuit Board

Final Finish

HASL Microetch

CONTACT US

More Products

EQUIPMENT/Cleaner 20

EQUIPMENT/Cleaner 20 is a highly concentrated detergent designed specifically to remove chemical scale, hard water scale, dry film and LPISM residue, and anti-foam residue from automated developing and resist stripping equipment.

POLY/Solv RS-740

POLY/Solv RS-740 is a highly concentrated solution designed to economically and efficiently strip most commercially available, fully aqueous dry film resists.

POLY/Solv RS-50

POLY/Solv RS-50 is a concentrated solution designed to economically and efficiently strip all commercially available, fully aqueous dry film resists.